AMD:K7(Socket A/462)
AMD Recommended up to XP2100+, MP2100+; INTEL:Socket 370
- 933MHZ and 1/1.26GHZ and 1.40 Ghz &
FC-PGA2 up to 2.20 GHz
Specification
Overall Dimension
70x63x46 mm
Thermal Resistance
AMD:0.49°C/W; INTEL®:0.59 °C/W
Weight
178 g
Heat Sink
Material
Aluminum A1070/A6063 & Chromeric T-725
Thermal Pad
Dimension
61.9x63x36.2 mm
Fan
Dimension
60x60x10 mm
Speed
4500 rpm
Bearing
Ball
Rated Voltage
12 V
Air Flow
19.86 cfm
Noise Level
33.84 dBA
Air Pressure
0.13 inch-H2O
Features
Higher Performance CPU cooler option: DC1206BM-U with 60x60x25 (mm)
Fan for XP 2200 and up
Also Available in DC1206BM-L/625-T and DC1206BM-L/638-T:
1. DC1206BM-L/625-T with 60x60x25 (mm) Fan: AMD
Recommended up to XP2100+, MP2100+
2. DC1206BM-L/638-T with 60x60x38(mm) Fan: AMD
Recommended up to XP2100+, MP2100+
Fan & Heatsink
Dimension
Bearing
Rated Voltage
Operation Voltage
Rated Current
Rated Input Power
Max. AirFlow
Max.Air Pressure
Speed
Operation Temp.
mm
V
V
A
W
CFM
inch-H2O
RPM
°C
60x60x10
Ball
12
12±15%
0.24
2.88
19.86
0.13
4500
-10°C ~ +65°C
Skiving fin Heat Sink
Material: Aluminum A1070/A6063 & Chromeric T-725 Thermal Pad
Dimension: 61.9x63x36.2
Pitch: 1.5 mm
Thickness of fin: 0.5 mm
Number of fins: 40
Height of fin: 20.75 mm
Height of base: 6.2 mm
Length of base: 10 mm
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