MCX603-V™ heatsink for Intel®
Xeon™processors (socket 603/604)
Made in the USA U.S. patent 6,469,898 and several other
patents pending
Introduction:
Following the recent release of the award winning
MCX462-V™ model, which defined an entirely new class of
high-performance and low noise heatsinks, we are now proud to
introduce the MCX603-V™ heatsink for Intel® Xeon™ processors.
The MCX603-V™ heatsink is of equal size and pin
design to the MCX462-V™, thus features identical performance and
usage specifications as outlined below:
Optimized performance characteristics at the lowest
possible audible noise levels.
Full compatibility with all Intel® Xeon retention systems,
thanks to two different retention solutions:
Plug-and-play installation with Intel's validated
retention mechanisms for OEM processors (does not necessitate
removal of the motherboard for installation).
Optional screw/spring assembly retention system (requires
removal of the motherboard for installation).
Features highlights
Hybrid copper base, thin
aluminum pin heatsink: the massive 1/2" thick copper base
provides superior heat capacity for unparalleled stability in
extreme overclocking applications. The thin aluminum pins promote
increased turbulence for more efficient heat dissipation compared
to traditional fin extrusions.
Patented Helicoid pin design
(U.S. patent 6,469,898): pins are individually machined in an
helicoid shape, to increase their surface area, and further
enhance heat dissipation efficiency.
Several patents pending for concentrically aligned rows of
pins, bent at multiple angles. The spacing and angles between the
concentric rows has been precisely calculated to optimize
cooling and reduce noise at air flow levels as low as 22 CFM and
23 dbA.
The MCX603-V™ is designed to work
with 80mm fans only. In effect, there is not
enough space between processors in most dual Xeon™ motherboards to
accomodate two 92mm fans side by side.
Quick and easy fan installation: the fan installs "in a
snap" with convenient snap-in rivets.
Exceptional quality and attention to details: the
heatsink base is lapped to 0.0003" (3/10 of 1/1000"), and polished
to near-mirror finish to promote optimum thermal conductivity.
Users are advised that while flatness is strictly respected for
providing the most significant benefit to thermal interface,
surface polish is a cosmetic component and may vary slightly from
one heatsink to another. Re-lapping or polishing the heatsink base
is never recommended.
Processor Compatibility: All
Intel® Xeon® processors
Motherboard compatibility: All (1)
Intel® compliant motherboards
socket 603 or socket 604 form factor.
The product is specially designed to allow installation with
motherbards were CPU are located side-by-side, as shown below.
Note that in such cases, 92mm fans cannot be used.
This picture shows 2 MCX603-V heatsinks installed side by side, and
illustrates the two different mounting mechanisms described in the
following chapter.
Retention Mechanisms
The MCX603-V ships with two brackets designed to allow
plug-and-play installation with OEM version Xeon™ processors.
Intel's validated solution for OEM processors sold without a
heatsink consists in two plastic retention frames and spring clips
(shown in the example below), which the motherboard manufacturers
normally provide. Installation of the MCX603-V with this setup
does not require removal of the motherboard.
click to enlarge
Swiftech's optional screw-spring assemblies allow installation
of the MCX603-V™ with all Xeon™ compliant motherboards, without
any known exceptions (1). Such installation
requires removal of the motherboard to retrofit it with Swiftech
proprietary retention mechanism composed of 4 standoffs and
locknuts. An example is provided below:
click to enlarge
Part # MCX603-VSR for heatsinks shipped prior to
12-15-03 (see note 2)
Part # MCX603-VSR2 for heatsinks shipped after 12-15-03 (see
note 2)
Because this product is intended to cover the widest possible
variety of uses, from virtually silent operations all the way to
extreme overclocking, it is sold without fan.
We have extensively tested a large number of fans in our labs.
Below is a list of the select few that were found to perform best
with the MCX462-V™ heatsink. Since the performance specifications of
the MCX462-V™ and the MCX603-V™ are identical, please use the list
below as a guideline to procure a fan appropriate to your
application. This list is intended to be updated as we receive more
fans from the manufacturers for testing.
For user convenience, we will from now on separate all our bench
tests into 3 distinct categories characterized by the fan's audible
noise level:
Silent to low noise operations 22 to 26 dbA: For non-overclocked
processors. The MCX478-V™ surpasses all known temperature
specifications published by Intel® to this date.
Medium noise operations: 28 dbA to 40 dbA - From mild to
serious overclocking levels depending on the fan selected, or high
temperature environments. Up to 100 Watts processor load.
High noise operations: 40 dbA and up - From serious to
extreme overclocking depending on the fan selected, up to 130 Watts
processor load.
Silent to low noise category -
Lower C/W is better
Brand
Size
(mm)
Part #
CFM
dbA
Heatsink-fan
°C/Watts ratio (*)
Vantec
92x25
SF9225L
28
20
0.333
Mechatronics
92x25
E9225S12B
29
24
0.307
Sunon
80x25
KD1208PTB4
25
23.4
0.307
NMB
80X25
3110NL-04W-B20
26.5
22.5
.291
Medium noise category - Lower
C/W is better
Brand
Part #
CFM
dbA
Heatsink-fan
°C/Watts ratio (*)
Sanyo Denki
92x32
109P0912H201
55.1
36
0.220
Delta
80x25
AFB0812HH
37.4
34
0.226
High noise category - Lower
C/W is better
Brand
Part #
CFM
dbA
Heatsink-fan
°C/Watts ratio (*)
Vantec
92x38
TD9238A
119
56.4
0.149
Vantec
80x38
TD8038H
84.1
55.2
0.145
* C/Ws shown are the heat sink to air values, excluding thermal
resistance of the TIM joint, which will vary depending on the
thermal interface used and bench test conditions. For reference,
Swiftech's TIM joint bench test value is 0.09°C/W. All tests are
performed in an environmental chamber using Industry standard
procedures, and calibrated equipment.