The MCW5000™ release 2 series of water-blocks are
extreme duty liquid cooling solutions for high-end microprocessors. They
are designed to be used either in straight liquid cooling configuration,
or in conjunction with thermoelectric cooling elements (MCW5000-PT™).
MCW5000-A™ for AMD® Duron®, Athlon® MP, and XP2600
and up.
MCW5000-P™ for Intel® Pentium® 4 (socket 478), 1.4
to 3Ghz and up.
MCW5000-PX™ (rev 2) for Intel® Xeon™ (socket
603/604), 1.4 to 3Ghz and up
NEW!
MCW5000-64™ for Athlon™ 64 & Opteron™ processors
MCW5000-PT
Thermoelectric assembly for Intel® Pentium® 4 (socket 478) processors
- See specific product page for more information.
Conversion from one version to another is extremely
simple, and only requires replacing the retention mechanism.
Examples of Installations:
MCW5000-A™ for AMD® socket 462
processors
Click to enlarge
NEW!
MCW5000-64™ for AMD® Athlon™64 & Opteron™
Click to enlarge
MCW5000-64™ for AMD® Athlon™64 &
Opteron™ processors, installs directly into AMD's newest
retention mechanism
MCW5000-P™ for Intel® Pentium® 4 processors
Click to enlarge
The MCW5000-P™ installs directly into Intel
stock retention frame without removing the motherboard
MCW5000-PX™ for Intel® Xeon processors
Click to enlarge
The MCW5000-PX™ (Rev.2) for Intel® Xeon™
OEM version processors (note 1) uses Intel's validated
retention mechanism and installs without removing the
motherboard
click to enlarge
Optionnaly, the MCW5000-PX™ can also use
Swiftech's screw/springs retention mechanism to install with
Intel Xeon retail version (note 2) processors (requires
removal of the motherboards)
Note 1: Intel® OEM processors sold without
cooling fan, use two plastic frames and spring clips supplied with the
motherboard.
Note 2: Intel® retail version processors sold
with "wind tunnel" cooling fan.
Exceptional quality and attention to details:
the base plate is lapped to 0.0003" (3/10 of 1/1000"), and
polished to near-mirror finish to promote optimum thermal
conductivity. Users are advised that while flatness is strictly
respected for providing the most significant benefit to thermal
interface, surface polish is a cosmetic component and may vary
slightly from one heatsink to another. Re-lapping or polishing the
copper base is never recommended.
Assembly:
Overall dimensions: L2.5" x W2.5" x H1.66"
(L63.5 x W63.5 x H42.16 mm)
Retention mechanism options:
Intel® Pentium® 4 processors (socket
478): stainless steel frame, 2 spring clips, (4) S/S socket
screws:
part #MCW5000-PRH
Intel® Xeon™ (socket 603/604)
processors: Effective 7/30/2003 the MCW5000-PX™ uses
Intel's validated retention mechanism and no longer requires
removal of the motherboard for installation. Motherboard
retention frame and clips are provided by motherboard
manufacturers and do not ship with the water-block.
The new MCW5000-PX retention frame is also
sold separately for upgrade purposes, and can be used with our
optional screw/spring retention mechanism, as shown below.